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The First Editorial Board Meeting of Soft Science in 2022 was Successfully Held Online

Published on: 27 Mar 2022 Viewed: 943

The First Editorial Board meeting of Soft Science (SS) was successfully held on March 25, 2022. Fourteen Editorial Board members participated in the meeting. The Editor-in-Chief, Professor Zhifeng Ren, presided over this meeting. The work summary of 2021 and the development plan in 2022 of SS were reported in this meeting.

Professor Zhifeng Ren gave a welcome speech for the opening. He was very grateful for the participated Editorial Board members. At the meeting, Professor Ren introduced the situation of SS and called on all Editorial Board members to actively contribute to the journal, which received positive responses, and all Editorial Board members expressed that they will work together to achieve the development goals of SS in 2022.

The Editor-in-Chief and the Editorial Office expressed their gratitude to the Editorial Board members for their strong support, and they stressed that SS will continue to adhere to high-quality publishing, fast publishing, and rigorous peer review process. We firmly believe that SS will bloom in the future with the guidance and support of the Editorial Board members.

Thanks for the support of the following Editorial Board members to this meeting (listed in no particular order):
Zhifeng Ren, University of Houston, Houston, TX, USA.
Chuanfei Guo, Southern University of Science and Technology, Shenzhen, Guangdong, China.
Cunjiang Yu, Pennsylvania State University, University Park, PA, United States.
Renkun Chen, University of California, San Diego, CA, United States.
Zhigang Chen, University of Southern Queensland, Springfield, QLD, Australia.
Nicholas X. Fang, Massachusetts Institute of Technology, Boston, MA, United States.
Haixia Zhang, Peking University, Beijing, China.
Junming Liu, Nanjing University, Nanjing, Jiangsu, China.
Takao Mori, National Institute for Materials Science, Tsukuba, Japan.
Young Min Song, Gwangju Institute of Science and Technology, Gwangju, Korea.
Zhigang Wu,  Huazhong University of Science and Technology, Wuhan, Hubei, China.
Yihui Zhang, Tsinghua University, Beijing, China.
Li-Dong Zhao, Beihang University, Beijing, China.
Da-Wei Wang, University of New South Wales, Sydney, NSW, Australia.

Soft Science
ISSN 2769-5441 (Online)
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All published articles are preserved here permanently:

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