Soft Science at ISFSE 2026: Strengthening Connections and Advancing Together
Soft Science participated in the 10th International Symposium on Flexible and Stretchable Electronics (ISFSE 2026), held in Wuhan, China, on October 23–25, 2026. The symposium brought together leading researchers and experts to share recent advances in flexible and stretchable electronics and explore emerging opportunities in the field. During the conference, Soft Science met with Prof. Yonggang Huang, Prof. Antonio Facchetti, and Prof. Dae-Hyeong Kim, a valued member of the journal's Editorial Board. The journal also held its third in-person Editorial Board meeting, where members exchanged views and discussed the journal’s ongoing development.
Figure 1. The ISFSE 2026 Conference Venue
We thank the ISFSE 2026 organizers, speakers, researchers, and members of the journal's Editorial Board for their contributions and support. The symposium also offered an opportunity to engage with the scientific community, exchange perspectives on emerging research, and strengthen ties with researchers in the field. These exchanges underscored the importance of collaboration in advancing innovation and interdisciplinary research.
Figure 2. Group photos with Prof. Yonggang Huang (left), Prof. Antonio Facchetti (upper right), and Prof. Dae-Hyeong Kim (lower right).
Looking ahead, Soft Science remains committed to providing a platform for high-quality research and innovative ideas in the fields of soft materials, flexible and stretchable electronics, intelligent systems, and related technologies. We look forward to strengthening our collaboration with the Editorial Board and the broader research community, supporting research in emerging areas, and building new partnerships with scholars worldwide. We hope these collaborations will advance scientific discovery and help translate research into real-world applications.
Figure 3. Group photo at ISFSE 2026 (top) and Soft Science Editorial Board meeting (bottom).
Editor: Jiaxin Li
Language Editor: Amir Khan
Production Editor: Xingyue Luo
Respectfully Submitted by the Editorial Office of Soft Science
