Soft Science Achieves Ei Compendex Indexing in July 2026

We are delighted to announce that Soft Science has been officially accepted for inclusion in Ei Compendex (Engineering Index) on July 14, 2026. This achievement marks a significant milestone in the journal’s development and reflects the growing recognition of its academic quality, editorial standards, and scientific impact within the global soft materials and soft devices research community.

As one of the world's leading engineering and technology literature databases, Ei Compendex indexes high-quality research across a broad range of disciplines. Indexing in Ei Compendex will further enhance the journal's global visibility, discoverability, and accessibility. Moving forward, Soft Science will continue to uphold high publishing standards, promote international scholarly exchange, and disseminate impactful research that advances the science, engineering, and practical applications of soft materials and devices.

We sincerely thank our Editorial Board Members, Guest Editors, authors, reviewers, and readers for their continued support and valuable contributions, which have been instrumental in the journal's growth and development. We look forward to continued collaboration as we work together to advance excellence and innovation in soft science.

Editor: Jiaxin Li
Language Editor: Amir Khan
Production Editor: Xingyue Luo
Respectfully Submitted by the Editorial Office of Soft Science