fig6

Figure 6. Application demonstration and performance evaluation of LCP-BN-Gs in thermal management. (A) Schematic diagram of the LED heat dissipation setup; (B) Evolution of the maximum temperature of LCP-BN-Gs over time; (C) Infrared thermal images of LCP-BN-Gs used as heat spreaders; (D) Schematic illustration of the thermal conduction pathway construction in LCP-BN-Gs; (E) Comprehensive performance comparison between LCP-BN-G-20 and other reported materials. LCP: Liquid crystal polyarylate; BN-G: functionalized boron nitride; LED: light-emitting diode; RCH: regenerated chitin; PI: polyimide; PEN: polyethylene naphthalate; PPS: polyphenylene sulfide.