fig7

Figure 7. Electrochemical deposition techniques for fabrication, interfacial evaluation, and patterning optimization of flexible electronic circuits. (A) Flexibility and foldability test results of p-Cu circuits on PET substrate^[91]; (B) Free-standing Cu thin film from an electroforming process^[92]; (C) Comparison of the graphene peel strength from the electroplated Cu and the Cu foil template. For the delamination of Cu film from graphene and CVD graphene from the Cu foil, an epoxy adhesive was used^[92]; (D) Comparison of conventional metal masks and HFMM for the screen printing process^[93]. PET: Polyethylene terephthalate; CVD: chemical vapor deposition; HFMM: hybrid fine metal mask.