fig6

Figure 6. Etching techniques for fabrication and performance characterization of flexible electronic circuits. (A) (i and ii) Circuit diagrams of a cascade amplifier (i) and a fifteen-stage CMOS RO (ii). (iii) Photographs of the cascade amplifier (top) and the CMOS RO (bottom). The scale bars in the panels denote 100 µm. (iv) Input and output waveforms of the cascade amplifier. (v) Oscillation frequency change of the fifteen-stage RO with V_dd increasing from 1 to 5 V. (vi) Output waveform of the fifteen-stage CMOS RO at V_dd = 5 V^[59]; (B) Flexible organic transistor on PET substrate^[60]; (C) Laser patterning process of the CFA film^[61]; (D) Electrochemical performance of MXene DSMSCs in different connection ways^[62]. CMOS: Complementary Metal-Oxide-Semiconductor; RO: ring oscillator; V_dd: power supply voltage; PET: polyethylene terephthalate; CFA: carbon conductive flexible adhesive; DSMSCs: double-side microsupercapacitors; GND: ground; DPP-DTT: poly[2,5-(2-octyldodecyl)-3,6-diketopyrrolopyrrole-alt-5,5-(2,5-di(thien-2-yl)thieno-[3,2-b]-thiophene)]; P(VDF-TrFE-CTFE): poly(vinylidene fluoride-trifluoroethylene-chlorotrifluoroethylene); MWNTs: multi-walled CNTs; 2D: two-dimensional; MSC: microsupercapacitor.