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Figure 6. Reducing adhesion at the film/donor interface based on stress engineering methods for damage-free transfer printing of metal films. (A) Schematic illustration showing the dry pickup process enabled by stress engineering; (B) Schematic illustrations describing the formation of single and bilayer-structured Pt thin films and the stress distribution; (C) Comparison of interfacial fracture toughness with strain energy release rates before and after bending; (D) Optical microscope images of cracked and crack-free surfaces of the transferred Pt thin films; (E) Construction of the functional 3D architecture from the 2D thin-film precursor. Reproduced with permission^[69]. Copyright 2024, Springer Nature. 3D: Three-dimensional; 2D: two-dimensional.