fig5

Figure 5. Reducing adhesion at the film/donor interface based on buffer layer-assisted methods for damage-free transfer printing of metal films. (A) Schematic illustration showing the dry pickup process enabled by the prior construction of a buffer layer on the donor substrate; (B) Photographs corresponding to Au patterns transferred onto a 4-inch PVA stamp and printed onto a 4-inch SiO₂ wafer; (C) Transfer printing of weakly (Cu, Ag, Au) and strongly (Pt, Ti, Ni) adhering metal films on SiO₂ substrate; (D) Au patterns transferred onto different substrates, including SiO₂, Gr/SiO₂, and MoS₂/SiO₂. Reproduced with permission^[44]. Copyright 2022, Springer Nature; (E) Diagrams of multilayer peel-off sheets without or with a buffer layer, and images of an Au ultrathin film transferred onto a tape with a Cu buffer layer. Reproduced with permission^[76]. Copyright 2022, Springer Nature. PVA: Polyvinyl alcohol.