fig4

Figure 4. Reducing adhesion at the film/donor interface based on in situ molecular intercalation methods for damage-free transfer printing of fragile resist films. (A) Schematic illustration showing the dry pickup process enabled by in situ incorporation of amphiphilic molecules into the resist matrix; (B) Illustrations of the intercalation mechanism in in situ molecular intercalated resists; (C) Energy release rate of the film/stamp interface and film/donor interface; (D) Distributed and conformal manufacturing based on in situ molecular intercalated resists. Reproduced with permission^[43]. Copyright 2024, Wiley-VCH; (E) The 50 mm resist films with the metalens pattern fabricated by PCCL; (F) The capability for damage-free transfer printing of resist films to the hemispherical substrate. Reproduced with permission^[74]. Copyright 2025, IOP Publishing. PCCL: Perfect conformal contact lithography.