Junior Editorial Board

Junior Editorial Board Members

Jinhye Bae

Department of NanoEngineering, University of California San Diego, San Diego, CA, USA.

Research Interests: Soft matter; Hydrogels; Stimuli-responsive polymers; Actuators/Sensors; 3D printing

Mahdi Bodaghi

Department of Engineering, School of Science and Technology, Nottingham Trent University, Nottingham, UK.

Research Interests: Mechanics of materials; Smart materials; Soft matters; Meta-materials; Soft robotics; Additive manufacturing; 4D printing technology; Machine learning

Changyong (Chase) Cao

Department of Mechanical & Aerospace Engineering, Case Western Reserve University, OH, USA.

Research Interests: Soft materials; Soft electronics; Soft robotics; 3D/4D printing; Printed electronics; Solid mechanics

Huipeng Chen

School of Advanced Manufacturing, Fuzhou University, Fuzhou, Fujian, China.

Research Interests: Flexible and stretchable electronics; Transistors; Sensors; Memory; Artificial synapse

Ying Chen

Institute of Flexible Electronics Technology of THU, Jiaxing, Zhejiang, China.

Research Interests: Flexible electronic technology; Stretchable electronics; Skin-like sensors

Weili Deng

School of Materials Science and Engineering, Southwest Jiaotong University, Chengdu, Sichuan, China.

Research Interests: Flexible electronics; Wearable devices; Piezoelectric/piezoresistive sensors; Functional materials

Kai Dong

Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing, China.

Research Interests: Smart textiles; Triboelectric nanogenerators; Self-powered sensing; Flexible and wearable electronics; Mechanical energy harvesting; Mechanical-to-electric conversion fibers; Flexible pressure sensors; Fiber electronic skins

Dongdong Han

College of Electronic Science and Engineering, Jilin University, Changchun, Jilin, China.

Research Interests: Laser technologies; Carbon-based MEMS; Flexible electronics

Tae Hee Han

Department of Organic and Nano Engineering, Hanyang University, Seoul, Korea.

Research Interests: Carbon nanomaterials; Functional fibers; Soft ionic materials

Mokarram Hossain

Department of Engineering, Swansea University, Swansea, UK.

Research Interests: Soft, responsive, and smart materials; 3D printing of soft materials; Experimental mechanics

Yong Hu

School of Materials Science and Engineering, Tongji University, Shanghai, China.

Research Interests: Soft hydrogels; Bioinstructive materials; DNA nanotechnology; Microfluidic droplet technology; Biointerfaces; Nanomedicine

Yougen Hu

Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, Guangdong, China.

Research Interests: Wearable, flexible, stretchable sensor; Tactile pressure sensors; Flexible printed electronics; Soft and hybrid electronics; Electronic packaging materials; Functional nano materials; EMI shielding materials; Microwave absorbing materials

Zheng Jia

School of Aeronautics and Astronautics, Zhejiang University, Hangzhou, Zhejiang, China.

Research Interests: Mechanics of hydrogels; Conductive hydrogels and elastomers; Hydrogel devices and machines; Hydrogel adhesives; Soft ionotronics

Qinglin Jiang

State Key Laboratory of Luminescent Materials and Devices, South China University of Technology, Guangzhou, Guangdong, China.

Research Interests: Organic thermoelectric materials; Wearable thermoelectric devices

Pengcheng Jiao

Ocean College, Zhejiang University, Zhoushan, Zhejiang, China.

Research Interests: Mechanical metamaterials; Soft sensors and advanced sensing; Triboelectric nanogenerators; Marine soft robotics; Artificial intelligence

Yuhang Li

Institute of Solid Mechanics, Beihang University, Beijing, China.

Research Interests: Stretchable electronics; Heat transfer; Mechanics of materials; Thermo-mechanical analysis

Hu Liu

National Engineering Research Center for Advanced Polymer Processing Technology, Zhengzhou University, Zhengzhou, Henan, China.

Research Interests: Flexible wearable strain sensor; Flexible aerogel based pressure sensor; Flexible thermal management materials; EMI shielding material

Ji Liu

Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Shenzhen, Guangdong, China.

Research Interests: Soft materials engineering; Bioinspired design and fabrication; Soft materials mechanics; 3D printing; Biomaterials and soft electronics

Mingchao Liu

School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore, Singapore.

Research Interests: Dynamic instabilities; Slender structures; Mechanical metamaterials; Shape-morphing structures; Soft robotics

Deepa Madan

Department of Mechanical Engineering, University of Maryland, Baltimore, MD, USA.

Research Interests: Flexible electronics; Flexible batteries; Flexible thermoelectric generator

Manmatha Mahato

Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Korea.

Research Interests: Soft robots; Structural carbon materials; Flexible energy devices

Ivan Rusev Minev

Department of Automatic Control and Systems Engineering, University of Sheffield, Sheffield, UK.

Research Interests: Conductive hydrogels; Conductive polymers; Electronic tissues; Neural interfaces; Electrode arrays; Bioelectronics

Amir K. Miri

Assistant Professor, Department of Biomedical Engineering, New Jersey Institute of Technology, NJ, USA.

Research Interests: Organs-on-Chips; Bioprinting; Microfluidics

Changhyun Pang

School of Chemical Engineering, Sungkyunkwan University, Suwon, Korea.

Research Interests: Nanostructures; Adhesion; Biomimetics; Soft electronics

Sungjune Park

School of Chemical Engineering, Sungkyunkwan University, Suwon, Korea.

Research Interests: Soft and stretchable electronics; Polymers; Liquid metals; Surfaces and interfaces; Nanomaterials

Young-Geun Park

Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.

Research Interests: Wearable electronics; 3D printing; Bioelectronics

Li Peng

Department of Polymer Science and Engineering, Zhejiang University, Hangzhou, Zhejiang, China.

Research Interests: Graphene nanofilm; Polymer; THz sensor; Photodetector; Thermal management; Composite material; Catalyst

Hoang-Phuong Phan

School of Mechanical and Manufacturing Engineering, University of New South Wales, Sydney, NSW, Australia.

Research Interests: Semiconductor nanomembranes; Wearable acoustic sensors; Implanted sensors; Biodegradable material

Umapathi Reddicherla

Principal Researcher, NanoBio High Tech Materials Research Center, Inha University, Incheon, South Korea.

Research Interests: Electronic skin; Energy harvesting; Triboelectric nanogenerator; Piezoelectric nanogenerator; Electrochemical sensors; Colorimetric sensors

Wooyoung Shim

Department of Materials Science and Engineering, Yonsei University, Seoul, Korea.

Research Interests: Low-dimensional materials; Ionic conductors

Ady Suwardi

Institute of Materials Research and Engineering, National University of Singapore, Singapore, Singapore.

Research Interests: Flexible substrates; 3D printing; Thermoelectrics

Shiyang Tang

Department of Electronic, Electrical and Systems Engineering, School of Engineering, University of Birmingham, UK.

Research Interests: Liquid metals; Microfluidics; Soft materials; Conductive composites; MEMS, Biosensors; Nanoparticles

Ye Tian

College of Medicine and Biological Information Engineering, Northeastern University, Shenyang, Liaoning, China.

Research Interests: Microfluidics; Functional fibers; Soft matter; Flexible electronics

Xuewen Wang

Institute of Flexible Electronics (IFE), Northwestern Polytechnical University, Xi'an, Shaanxi, China.

Research Interests: Flexible sensing materials; Flexible sensor system; 2D materials; Flexible mechanical sensors

Yao Wang

School of Materials Science and Engineering, Beihang University, Beijing, China.

Research Interests: Hybrid materials; Thermoelectric; Dielectric; Piezoelectric; Wearable sensors; Electrostatic energy storage

Yew Hoong Wong

Department of Mechanical Engineering Faculty of Engineering, University Malaya, Kuala Lumpur, Malaysia.

Research Interests: Electronic materials; Semiconductors; Electronic packaging materials; Gas sensors; Gate dielectric; Functional nanomaterials

Jiwoong Yang

Department of Energy Science and Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu, South Korea.

Research Interests: Quantum dots; Nanocrystals; Flexible optoelectronic devices; Flexible displays; Photodetectors; Image sensors; Flexible energy devices

Jongwon Yoon

Department of Energy & Electronic Materials, Korea Institute of Materials Science, Changwon-si, Korea.

Research Interests: Flexible electronics; Wearable electronics; Thin film transistors; Twodimensional materials; Optoelectronic sensors; Flexible gas sensorse

Libing Zhang

Department of Chemistry, Tianjin University, Tianjin, China.

Research Interests: Biotemplated nanomaterials; Biomolecular sensors; DNA nanotechnology; Intracellular molecular delivery

Yichuan Zhang

School of Chemistry and Chemical Engineering, Southwest University, Chongqing, China.

Research Interests: Wetting; Contact angle; Carbon nanotubes; Thermoelectric composite; Conductive polymer composites

Jianwen Zhao

Department of Mechanical Engineering, Harbin Institute of Technology, Weihai, Shandong, China.

Research Interests: Soft robotics; Soft sensing

Zeang Zhao

Institute of Advanced Structure Technology, Beijing Institute of Technology, Beijing, China.

Research Interests: Mechanics of soft materials; Additive manufacturing of polymers; Designing of architecture materials

Hai Zhong

Institute of New Energy Technology, Jinan University, Guangdong, China.

Research Interests: Flexible rechargeable batteries; Electrochemistry; Materials chemistry

Pingan Zhu

Department of Mechanical Engineering, City University of Hong Kong, Hong Kong, China.

Research Interests: Microfluidics; Fluid dynamics; Surface wettability; Micro/nanorobots; Biomimetics

Ali Zolfagharian

School of Engineering, Deakin University, Geelong, VIC, Australia.

Research Interests: Shape memory materials; Smart materials; Soft robots; 3D/4D printing

Soft Science
ISSN 2769-5441 (Online)
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