Special Issue

Topic: Smart Hydrogels for Flexible Electronics

A Special Issue of Soft Science

ISSN 2769-5441 (Online)

Submission deadline: 16 Mar 2025

Guest Editor(s)

Prof. Hongjing Wu
School of Physical Science and Technology, Northwestern Polytechnical University, Xi'an, Shaanxi, China.
Assoc. Prof. Jin Wu
School of Electronics and Information Technology, Sun Yat-Sen University, Guangzhou, Guangdong, China.
Assoc. Prof. Yan Wang

Department of Chemical Engineering, Guangdong Technion-Israel Institute of Technology, Shantou, Guangdong, China.

Special Issue Introduction

Smart hydrogels, with their unique physicochemical properties, are becoming key materials in the manufacturing field of flexible electronic devices. Their high water content, excellent biocompatibility, adjustable mechanical properties, and significant microwave absorption capabilities not only provide novel possibilities for biomedical and environmental responsiveness applications but also open new avenues to improve the electromagnetic compatibility and electromagnetic interference shielding capabilities of electronic devices.

This Special Issue will showcase the synthesis methods of smart hydrogels, strategies for performance optimization, and their innovative uses in flexible electronic devices, while exploring the current challenges and future development prospects in this field.

We invite submissions of original research, review articles, and perspectives. Authors are encouraged to share their latest findings in the synthesis of smart hydrogels, performance regulation, and practical implementations in flexible electronic devices. All submissions will undergo a rigorous peer review process to ensure that the published articles are of high quality and innovation.

We look forward to these research results driving the further advancement of smart hydrogels in flexible electronics and promoting the commercialization and practical use of related technologies.


Smart hydrogel synthesis, conductive hydrogels, performance optimization strategies, electromagnetic wave absorption/shielding, biomedical applications, electronic skin, wearable sensors

Submission Deadline

16 Mar 2025

Submission Information

For Author Instructions, please refer to https://www.oaepublish.com/ss/author_instructions
For Online Submission, please login at https://oaemesas.com/login?JournalId=ss&IssueId=ss240627
Submission Deadline: 16 Mar 2025
Contacts: Inga Ren, Assistant Editor, Assistant_Editor@softscijournal.com

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Soft Science
ISSN 2769-5441 (Online)
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