Special Topic

Topic: Implantable Neural Interfaces: Materials, Fabrication, and Integrated Systems

A Special Topic of Soft Science

ISSN 2769-5441 (Online)

Submission deadline: 31 Oct 2026

Guest Editors

Prof. John A. Rogers
Departments of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
Dr. Yiyuan Yang
Department of Biomedical Engineering, National University of Singapore, Singapore, Singapore.
Assoc. Prof. Guangfu Wu
School of Medicine, Tongji University, Shanghai, China.
Prof. Jia Huang
School of Medicine, Tongji University, Shanghai, China.

Special Topic Introduction

Implantable neural interfaces are transforming how we investigate, modulate, and restore the nervous system. By enabling stable and high-fidelity communication between electronic devices and neural tissue, these technologies are driving breakthroughs in neuroscience research, neuroprosthetics, brain-machine interfaces, and bioelectronic medicine. However, conventional rigid implants often face challenges such as mechanical mismatch with soft neural tissue, chronic inflammatory responses, and limited functionality, which constrain long-term performance and hinder clinical translation.

 

Recent advances in soft, flexible, and bioadaptive materials, micro- and nanofabrication technologies, biodegradable electronics, and multimodal sensing are rapidly redefining the neural interface landscape. Mechanically compliant probes that match tissue modulus, transient electronic systems designed for programmed bioresorption, and thin, flexible interfaces capable of simultaneous electrical, optical, and chemical sensing and intervention are creating unprecedented opportunities for neural sensing and modulation, enabling sophisticated investigations of neural functions and more effective treatments for neurological disorders. Meanwhile, innovations in packaging, wireless power transfer and communication, and closed-loop control strategies are accelerating the evolution of neural implants from isolated components into fully integrated intelligent systems, facilitating more convenient and automated neurointervention in real-world settings.

 

This Special Issue aims to highlight state-of-the-art progress and emerging directions in materials science, device engineering, and system-level integration for next-generation implantable neural interfaces. We welcome original research articles and authoritative reviews addressing fundamental scientific challenges, technological innovations, and translational pathways toward achieving chronically stable, safe, and multifunctional neural technologies.

 

Topics of interest include, but are not limited to:

● Soft, flexible, and stretchable materials for neural probes and electrodes with enhanced biocompatibility and long-term stability;

● Bioabsorbable and biodegradable electronic platforms for transient neural interfacing and therapeutic applications;

● Advanced micro-and nanomanufacturing approaches enablinghigh spatial density, minimally invasive, and three-dimensional neural interfaces;

● New implantation strategies for precise positioning and minimization of mechanical damageto brain tissue;

● Multimodal neural interfacesintegrating sensing and modulationcapabilities;

● Encapsulation strategies for stable and sustainabledeviceoperation;

● Wireless power transfer, artificial intelligence(AI)-enabled edge computing for efficient multimodal data interpretation, and closed-loop neuromodulation systems;

● In vivo validation of neural technologies toward clinical translation.

Keywords

Implantable neural interfaces, soft bioelectronics, multimodal neuromodulation, biodegradable neural devices, wireless closed-loop systems

Submission Deadline

31 Oct 2026

Submission Information

For Author Instructions, please refer to https://www.oaepublish.com/ss/author_instructions
For Online Submission, please login at https://www.oaecenter.com/login?JournalId=ss&IssueId=ss26022510388
Submission Deadline: 31 Oct 2026
Contacts: Jiaxin Li, In-house Editor, [email protected]

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ISSN 2769-5441 (Online)
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