Special Topic

Topic: Flexible Intelligent Sensing and Thermal Interface Materials

A Special Topic of Soft Science

ISSN 2769-5441 (Online)

Submission deadline: 15 Jul 2026

Guest Editors

Dr. Xiao Chen
School of physics and astronomy, Beijing Normal University, Beijing, China.
Dr. Huitao Yu
School of Materials Science and Engineering, Inner Mongolia University of Science and Technology, Baotou, Inner Mongolia, China.
Dr. Yancong Qiao
School of Biomedical Engineering, Sun Yat-sen University, Shenzhen, Guangdong, China.

Special Topic Introduction

Flexible intelligent sensing and thermal interface materials represent a cutting-edge research frontier driving the development of next-generation flexible electronics, wearable devices, and human-machine interaction systems. These materials play a critical role in enabling real-time, accurate perception of environmental and physiological signals, as well as efficient thermal management for devices operating under complex mechanical deformations. In recent years, continuous breakthroughs in materials science, micro/nano-fabrication techniques, and integration technologies have significantly accelerated the development of flexible sensing systems and thermal interface materials with high sensitivity, stretchability, adaptability, and excellent thermal regulation performance. Such progress has laid a solid foundation for the realization of more comfortable, reliable, and intelligent human-machine interaction and environment-integrated systems. Innovations in flexible intelligent sensing and thermal interface materials are profoundly influencing a wide range of emerging applications, such as wearable health monitoring systems, intelligent bionic skin, soft robotics, high-power flexible electronics, and the intelligent Internet of Things.

 

This Special Issue aims to compile the latest advances in flexible intelligent sensing and thermal interface materials, with a focus on material innovation, structural design, mechanism exploration, integration processes, and system-level applications. We invite submissions of high-quality original research articles and reviews.

Topics of interest include, but are not limited to:

1. High-sensitivity, highly stretchable, and multimodal flexible sensors;

2. Deformable thermal interface materialswith high thermal conductivity and low interfacial thermal resistance;

3. Heat transfer mechanisms and durability of thermal interface materials;

4. Multifunctional composite materials for integrated signal sensing and thermal management;

5. Materials and devices for flexible intelligent sensing and thermal management in extreme environments;

6. Artificial intelligence(AI)-driven material design, performance prediction, and device optimization;

7. Numerical simulationof sensing mechanisms and heat transfer behavior.

Keywords

Flexible intelligent sensing, thermal interface materials, wearable electronics, stretchable sensors, thermal management, multifunctional composites, AI-driven design, numerical simulation

Submission Deadline

15 Jul 2026

Submission Information

For Author Instructions, please refer to https://www.oaepublish.com/ss/author_instructions
For Online Submission, please login at https://www.oaecenter.com/login?JournalId=ss&IssueId=ss26011210348
Submission Deadline: 15 Jul 2026
Contacts: Lydia Li, In-house Editor, [email protected]

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Soft Science
ISSN 2769-5441 (Online)
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