Special Topic

Topic: Flexible Electronic Skins and Human-Machine Interface Technologies

A Special Topic of Soft Science

ISSN 2769-5441 (Online)

Submission deadline: 31 May 2026

Guest Editors

Asst. Prof. Yu Song

Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.

Asst. Prof. Haotian Chen

Biomedical Engineering, James Watt School of Engineering, University of Glasgow, Scotland, United Kingdom.

Special Topic Introduction

We are pleased to announce a special issue call for Soft Science on "Flexible Electronic Skins and Human-Machine Interface Technologies". Flexible electronic skins (e-skins) and human-machine interface (HMI) technologies are revolutionizing the way humans interact with the digital world. Combining advances in soft materials, wearable sensors, and intelligent systems, these technologies enable real-time sensing, adaptive feedback, and seamless integration with the human body.

This special issue focuses on recent breakthroughs in materials, design strategies, and applications of flexible e-skins and HMIs, with potential impacts across healthcare, robotics, and interactive systems. We invite contributions that push the boundaries of innovation in this exciting and fast-growing field.

Key areas of interest include, but are not limited to:

· Advanced Soft Materials for High-Performance Electronic Skins;

· Multimodal Sensing and Data Fusion Strategies for Next-Generation HMIs;

· Wearable HMI Systems for Healthcare, Robotics, and Immersive Interfaces.