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Materials Informatics Summit Forum 2024

Published on: 18 Apr 2024 Viewed: 329

Date: April 26th - April 29th, 2024

Location: Wenhui Hotel,  Kunming University of Science and Technology, Kunming, China

General Information:

We are delighted to announce the Materials Informatics Summit Forum 2024, scheduled from April 26th to April 29th, 2024, at the Wenhui Hotel, Kunming University of Science and Technology, Kunming, China. This conference will focus on the field of Materials Informatics.

Our goal is to promote academic exchanges among scholars in materials informatics, materials genetic engineering, materials big data, machine learning, multi-scale materials design, and related fields, share research experience, explore cooperation opportunities, and promote the cross-integration advancement between disciplines. Additionally, the conference aims to explore the profound impact and promotion effects of artificial intelligence on the emerging materials industry to achieve high-quality, efficient, and low-cost sustainable development. Distinguished experts from various fields will gather to discuss the critical role of artificial intelligence in new materials design, intelligent manufacturing, industrial innovation, and the latest research findings in these domains.

The event is organized by the Key Laboratory of Materials Informatics, Guangzhou Institute of Technology, Hong Kong University of Science and Technology (Guangzhou), Institute of Material Genome, Shanghai University, Institute of Material Genome and Big Data Research, Harbin Institute of Technology (Shenzhen), OAE Publishing Inc., and School of Materials Science and Engineering, Kunming University of Science and Technology. It is hosted by Xi'an Ekerns Information Technology Co., Ltd., Journal of Materials Informatics Editorial Department, and Hongzhiwei Technology (Shanghai) Co., Ltd.

Organizing Committee

Chair:

Tongyi Zhang

Academician of the Chinese Academy of Sciences, Director of the Key Laboratory of Materials Informatics in Guangzhou, Chinese University of Science and Technology (Hong Kong), Dean of the Institute of Material Genome at Shanghai University, expert in materials science, engineering science, and solid mechanics, and Editor-in-Chief of the Journal of Materials Informatics.

Executive Chair:

Xingjun Liu

Foreign Member of the Russian Academy of Sciences, National Distinguished Youth Scholar, Dean of the Institute of Material Genome and Big Data Research at Harbin Institute of Technology.

Co-Executive Chairs:

Jing Feng

National Outstanding Talent, China Youth May 4th Medal, First Powerful Country Young Scientist Award, Dean of School of Materials, Kunming University of Science and Technology.

Xiaoyu Chong

Professor at the School of Materials Science and Engineering, Kunming University of Science and Technology, selected for the Young Talent Promotion Project of the China Association for Science and Technology.

Rongshi Pei

Professor of School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), National Young Talent

Members:

Yi Wang, Northwestern Polytechnical University

Lijun Zhang, Central South University

Xingyu Gao, Institute of Applied Physics and Computational Mathematics

Mingqing Liao, Jiangsu University of Science and Technology

Jingjin He, Kunming University of Science and Technology

Fei Zhang, Kunming University of Science and Technology

Registration (RMB) :

AttendeeBefore April 1stAfter April 1st
Students8001000
Normal12001400
Enterprise22002400

Program

DateArrangement
April 26thSign in
April 27thConference report
April 28thEditorial Board meeting
April 29thWind up the meeting

Contact:

If you have any questions, please contact:

Miss Li       Tel: 13619252855

Miss Fan    Tel: 18191037501

Miss Cui    Email: editorialoffice@jmijournal.com

Organizations

Organizers:

Co-organizers:

Sponsors:

Editor: Shujing Cui
Language Editor: Emma Chen
Production Editor: Yan Zhang
Respectfully Submitted by the Editorial Office of the Journal of Materials Informatics

Journal of Materials Informatics
ISSN 2770-372X (Online)
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