Editorial Board

Editor-in-Chief

Jun-Hu Cheng

[email protected]

School of Food Science and Engineering, South China University of Technology, Guangzhou, Guangdong, China.

Research Interests: food technology, food physical processing technologies, non-destructive testing technology, intelligent packaging sensors

Co-Editors-in-Chief

Simon X. Yang

Advanced Robotics & Intelligent Systems (ARIS) Lab, School of Engineering, University of Guelph, Guelph, Ontario, Canada.

Research Interests: artificial intelligence, robotics, intelligent systems, neural networks, fuzzy systems, multi-sensor fusion, intelligent control, human-robot interaction, bio-inspired intelligence

Xin-An Zeng

School of Food Science and Engineering, Foshan University, Foshan, Guangdong, China.

Research Interests: food processing, non-thermal processing technologies, pulsed electric fields, cold plasma, food quality and safety, fruit and vegetable processing

Associate Editors

Kevin M. Keener

School of Engineering, University of Guelph, Guelph, Ontario, Canada.

Research Interests: food technology, food safety, bioprocessing, non-thermal technologies: cold plasma, ozone, pulsed electric fields, electromagnetics, ultrasound, irradiation, ultraviolet light, high pressure processing, thermal technologies: radiant frying, radiant heating, retort canning, heat sterilization, baking, drying, extrusion

Jiangbo Li

Intelligent Equipment Research Center, Beijing Academy of Agriculture and Forestry Sciences, Beijing, China.

Research Interests: non-destructive testing of agricultural products/foods, machine vision/hyperspectral/multispectral imaging, near-infrared non-destructive testing technology, intelligent grading systems/equipment for agricultural products/foods, intelligent packaging materials/sensors

Hong-Wei Xiao

College of Engineering, China Agricultural University, Beijing, China.

Research Interests: food technology, food drying, thermal processing, heat and mass transfer, blanching, osmotic dehydration, freezing, non-thermal processing technology, artificial intelligence technology

Editorial Board Members

Guanglong Du

School of Computer Science and Engineering, South China University of Technology, Guangzhou, Guangdong, China.

Research Interests: robotics, machine vision, human-robot interaction, teleoperation, intelligent control, autonomous systems

Bahram Hosseinzadeh Samani

Department of Mechanical Engineering of Biosystems, Shahrekord University, Shahrekord, Chaharmahal and Bakhtiari, Iran.

Research Interests: food technology, non-thermal technologies: cold plasma, ozone, pulsed electric fields, electromagnetics, ultrasound, ultraviolet light, high pressure processing, thermal technologies: sterilization, drying, biodiesel production and oil extraction

Bo Ling

College of Mechanical and Electronic Engineering, Northwest A&F University, Yangling, Shaanxi, China.

Research Interests: emerging processing technologies, radio frequency and microwave heating, thermal and dielectric properties of agricultural products, food processing modeling, process intensification and extraction, value-added utilization of fruit and vegetable byproducts

Zhi-Wei Liu

School of Food Science and Technology, Hunan Agricultural University, Changsha, Hunan, China.

Research Interests: food technology: protein modification and food protein allergy, non-thermal technologies: cold plasma, pulsed electric fields, high pressure processing

Qin Ouyang

School of Food Science and Engineering, Jiangsu University, Zhenjiang, Jiangsu, China.

Research Interests: food quality, food safety, nondestructive detection technology, spectral imaging, nanosensing technology, artificial intelligence

Yankun Peng

College of Engineering, China Agricultural University, Beijing, China.

Research Interests: non-destructive testing of agricultural products and foods, hyperspectral imaging, machine vision, spectroscopy, food quality and safety, intelligent sensing equipment

Wen-Hao Su

College of Engineering, China Agricultural University, Beijing, China.

Research Interests: intelligent agricultural robotics, embodied artificial intelligence, intelligent sensing and decision-making, cross-modal representation, computational perception, collaborative control

Wenjun Wang

College of Biosystems Engineering and Food Science, Zhejiang University, Hangzhou, Zhejiang, China.

Research Interests: novel approaches for food engineering, sonoprocessing, hydrocolloids, protein processing, food packaging

Jingzhu Wu

School of Computer and Artificial Intelligence, Beijing Technology and Business University, Beijing, China.

Research Interests: intelligent sensing, hyperspectral imaging, multimodal spectroscopy, ai for food quality and safety, precision nutrition and dietary computing, miniaturized sensing systems

Shijia Wu

School of Food Science and Technology, Jiangnan University, Wuxi, Jiangsu, China.

Research Interests: food safety detection and control, aptamers, biosensors, nanomaterials, food contaminant detection, artificial intelligence-assisted biosensing

Zhenlin Xu

College of Food Science, South China Agricultural University, Guangzhou, Guangdong, China.

Research Interests: food safety, immunoassay, biosensors, rapid detection of food contaminants, food quality control, food safety risk assessment

Bowen Yan

School of Food Science and Technology, Jiangnan University, Wuxi, Jiangsu, China.

Research Interests: food processing, food engineering, microwave heating, electromagnetic field, numerical simulation, heat sterilization

Xinting Yang

School of Food and Health, Beijing Technology and Business University, Beijing, China.

Research Interests: food safety traceability, agricultural informatization, intelligent sensing, food quality monitoring, big data analytics, artificial intelligence

Wentao Zhang

College of Food Science and Engineering, Northwest A&F University, Yangling, Shanxi, China.

Research Interests: food safety control, nanotechnology, nanozymes, biosensors, food contaminant detection, antimicrobial food packaging

All members of the Editorial Board have identified their affiliated institutions or organizations, along with the corresponding country or geographic region. OAE Publishing Inc. remains neutral with regard to any jurisdictional claims.