fig5

Figure 5. Encapsulation properties of inorganic/organic materials. (A) Schematic view of multi-layer stacking method for minimum defect. Reproduced with permission^[98], Copyright 2014, Wiley-VCH GmbH; (B) Encapsulation properties of various inorganic materials. Reproduced with permission^[98], Copyright 2014, Wiley-VCH GmbH; (C) Dissolution rates of p⁺-Si (boron, 10²⁰ cm^-3) in various conditions. Reproduced with permission^[30], Copyright 2017, American Chemical Society; (D) Dissolving images of Mg encapsulated by various materials: thermal SiO₂, Al₂O₃/Parylene C, and bulk film of LCP. Reproduced with permission^[105], Copyright 2016, Proceedings of the National Academy of Sciences; (E) Preparation of C_SS polyester copolymers. Reproduced with permission^[102], Copyright 2023, Springer Nature; (F) Mechanical property C_SS tested at 10 mm/min. Reproduced with permission^[102], Copyright 2023, Springer Nature; (G) Encapsulation properties of various C_SS. Reproduced with permission^[102], Copyright 2023, Springer Nature; (H) Schematic drawing of biodegradable CAP. Reproduced with permission^[34], Copyright 2023, American Chemical Society; (I) Elastic property of CAP/P40 film tensile strain of ~300%. Reproduced with permission^[34], Copyright 2023, American Chemical Society; (J) Encapsulation properties of various PLCL-based encapsulants. Reproduced with permission^[34], Copyright 2023, American Chemical Society. PECVD: Plasma-enhanced chemical vapor deposition; ALD: atomic layer deposition; HBSS: Hank’s balanced salt solution; PBS: phosphate-buffered saline; PLCL: poly(l-lactide-co-ε-caprolactone); CAP: composite-based arrayed pillar; LCP: liquid crystal polymer.