fig3

Figure 3. Fabrication of the flexible tactile sensor. (A) Preparation of the Si substrate; (B) Spin-coating and curing PI film; (C) Sputtering and lift-off of a Cu sacrificial layer; (D) Sputtering and lift-off of a Si layer; (E) Spin-coating and curing a second layer of PI film (10 µm); (F) Sputtering and lift-off of Pt piezoresistors; (G) Sputtering and lift-off Au electrodes; (H) RIE of PI; (I) Removing the Cu sacrificial layer; (J) Pouring and curing of an elastomer. PI: Polyimide; RIE: reaction ion etching; Si: silicon.