fig6

Effect of trace rare earth La on the thermal stability of oxygen-free copper

Figure 6. ODF sections of φ2 = 0°, φ2 = 25°, φ2 = 45° and φ2 = 65° of OFC with different La contents after annealing at 900 °C for 30 min: (A) 6N Cu, (B) La11, (C) La31, (D) La180, (E) La330.

Microstructures
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