fig20

Figure 20. Texture engineering modulates electromechanical breakdown in MLCCs. (A) Schematic illustrating electromechanical breakdown mechanisms in dielectric ceramics based on coupled electrical and mechanical responses; (B) Distributions of local electric field and local stress under 20 MV/m in the dielectric layers of <111>-textured and nontextured MLCCs. This figure is quoted with permission from Wang et al.^[153]. MLCCs: multilayer ceramic capacitors.