fig1

From: Interface-engineered Bi₂Te₃ powders via atomic layer deposited TiO₂-ZnO multilayer for improved thermoelectric performance

Interface-engineered Bi<sub>2</sub>Te<sub>3</sub> powders via atomic layer deposited TiO<sub>2</sub>-ZnO multilayer for improved thermoelectric performance

Figure 1. Sample preparation process flowchart. ALD: Atomic layer deposition; DEZ: diethylzinc; TTIP: titanium isopropoxide; SPS: spark plasma sintering; TZ-NL: TiO₂/ZnO nanolaminate.

Microstructures

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