fig8

Machine learning-driven design and optimization of electronic packaging: applications and future developments

Figure 8. (A) Workflow for 3D XRM measurement; (B) Deep learning network model: reconstruct a high-quality 3D XRM volume dataset with low noise and minimal artefacts through a small amount of X-ray projection and/or exposure time; (C) XRM data for lens components of smartphone cameras: FDK and DeepRecon comparison[264]. XRM: X-ray microscopy; FDK: Feldkamp-Davis-Kress.

Journal of Materials Informatics
ISSN 2770-372X (Online)
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