fig5

Machine learning-driven design and optimization of electronic packaging: applications and future developments

Figure 5. (A) Detailed structure of the original YOLOX model; (B) Detailed structure of ConvNeXt-YOLOX; (C) ConvNeXt-YOLOX results in PCBA solder joint defect detection; (D) YOLOX results in PCBA solder joint defect detection; (E) YOLOX-s results in PCBA solder joint defect detection[193]. PCBA: Printed circuit board assemblies.

Journal of Materials Informatics
ISSN 2770-372X (Online)
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