fig5

Improved thermoelectric performance by grain connectivity in bismuth antimony telluride composite with metallic high-entropy alloy nanoparticles

Figure 5. (A) Seebeck coefficients as a function of nH with the Pisarenko plots of the hot-pressed BST+HEAx (x = 0, 0.1, 0.5, and 1.0 vol%) samples for the Pa- and Pe-directions; (B) Fermi energies EF and the mean free paths of the carrier λe; (C) room-temperature power factors S2σ; (D) electrical grain connectivity Gconn. as a function of the HEA concentrations at room temperature. HEA: High entropy alloy; BST: Bi0.4Sb1.6Te3.

Energy Materials
ISSN 2770-5900 (Online)
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