Special Issue

Topic: Microstructure and Properties of High-entropy Materials

A Special Issue of Microstructures

ISSN 2770-2995 (Online)

Submission deadline: 1 Sep 2023

Guest Editor(s)

Prof. Yong Zhang
State Key Laboratory of Advanced Metallic Materials, University of Science and Technology Beijing, Beijing, China.
Prof. Yunfei Xue
Beijing Institute of Technology, Beijing, China.
Prof. Guoqiang Xie
Harbin Institute of Technology (Shenzhen), Shenzhen, China.

Special Issue Introduction

High-entropy materials are a kind of unique materials developed based on the configurational entropy maximization, which include high-entropy metallic alloys, high-entropy ceramics, high-entropy intermetallic compounds, high-entropy semiconductors, and high-entropy polymers. The configurational entropy was defined by the Boltzmann equation, S=kLnW, S is the configurational entropy, k is the Boltzmann constant, and W is the micro-states corresponding to the macro-system studied. High-entropy materials can break the property limits of the traditional materials, break the trade-off between strength and ductility, and potentially increase the reliability of the performance of materials by balancing various properties. The wonderful and unique properties of materials are usually originated from their micro- and nano-level structures, and the structures of materials can be controlled by the compositions and processing. The Special Issue will focus on the relationship between the microstructure and properties of high-entropy materials. We welcome manuscripts from many disciplines and particularly encourage research that has made significant progress in inducing novel mechanical, physical, chemical, and biomedical properties by nano- and micro-level structures.

The Special Issue will include (not limited to) the following subjects:
● Materials design, processing, characterization, properties, and performance of High-entropy materials;
● The high-entropy materials can be powders and or particles, wires and fibers, films and coatings, bulk materials;
● Materials developments based on high-throughput technology, machine learning, and materials genome engineering;
● Microstructures characterized by neutrons and synchrotrons;
● Performance and applications of the high-entropy materials.

Submission Deadline

1 Sep 2023

Submission Information

For Author Instructions, please refer to https://www.oaepublish.com/microstructures/author_instructions
For Online Submission, please login at https://oaemesas.com/login?JournalId=microstructures&IssueId=M220322
Submission Deadline: 1 Sep 2023
Contacts: Mengyu Liu, Assistant Editor, assistant_editor@microstructj.com

ISSN 2770-2995 (Online)
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