Special Topic
Topic: Microstructure Engineering and Performance Optimization in Thermoelectrics
Guest Editors
Special Topic Introduction
Achieving high-performance thermoelectric materials requires the effective decoupling of electronic and phonon transport, whose inherent interdependence has long limited the efficiency of direct heat-to-electricity conversion. Microstructure engineering offers a powerful route to overcome this constraint through the rational control of grain boundaries, dislocations, nanoinclusions, and hierarchical architectures. This special issue aims to bring together cutting-edge research on the design, synthesis, characterization, and performance optimization of microstructurally tailored thermoelectrics, spanning conventional alloys, low-dimensional materials, and emerging topological systems. By integrating experimental advances with multiscale modeling, advanced microscopy, and in situ characterization, the contributions will establish new structure–transport relationships and provide practical strategies for independently optimizing charge and heat transport. Collectively, this Special Issue aims to advance next-generation thermoelectric technologies for efficient and sustainable waste-heat recovery, power generation, and solid-state cooling.
Keywords
thermoelectric materials, thermoelectric properties, microstructure, thermoelectric modules, phonon transport
Submission Deadline
Submission Information
For Author Instructions, please refer to https://www.oaepublish.com/microstructures/author_instructions
For Online Submission, please login at https://www.oaecenter.com/login?JournalId=microstructures&IssueId=microstructures26072910560
Submission Deadline: 15 Jan 2027
Contacts: Juno, Assistant Editor, [email protected]







