Announcement of Microstructures 2023 Best Paper Awards, Best Reviewer Awards, Best Editor Award & Best Youth Scholar Award
We are pleased to announce the Microstructures annual awards- Best Paper Awards (Table 1), Best Reviewer Awards (Table 2), Best Editor Award and Best Youth Scholar Award (Table 3) in recognition of authors, reviewers, and Editorial Board Members for their particularly outstanding contributions to Microstructures. Awardees were carefully selected by the Award Committee, which consists of the Editor-in-Chief and experienced editors of Microstructures. Congratulations to the following awardees!
Best Paper Award:
The papers published in 2022 were selected through a rigorous process and evaluated by the Journal Award Committee based on the following criteria:
– Scientific merit and broad impact;
– Evaluations from scientific committees;
– Creativity of the study design or valuable and targeted reviews;
– Citation and download numbers.
Table 1: Winners of Best Paper Award
Article title | Authors | DOI |
A critical review of the mechanical properties of CoCrNi-based medium-entropy alloys | Dingfeng Xu, Mingliang Wang*, Tianxin Li, Xiangsai Wei, Yiping Lu* | |
Hollow microstructural regulation of single-atom catalysts for optimized electrocatalytic performance | A-Wu Zhou, Ding-Sheng Wang*, Ya-Dong Li |
Congratulations to the above award-winning scholars, and welcome to read the articles.
Best Reviewer Awards:
The reviewers who reviewed papers from January 1, 2023, to December 31, 2023, were selected by the Journal Award Committee based on the following criteria:
– Number of review reports (only the first-round review reports are considered);
– Review quality based on the rating given in MESAs;
– Review speed.
Table 2: Winners of Best Reviewer Award
Name | Institution |
Dong-Sheng Li | China Three Gorges University, China |
Fupin Liu | Leibniz-Institut für Festkörper- und Werkstoffforschung Dresden, Germany |
Fangping Zhuo | Technical University of Darmstadt, Germany |
Guangshan Zhu | Northeast Normal University, China |
Morgan Trassin | ETH Zurich, Switzerland |
Reddicherla Umapathi | Inha University,South Korea |
Shaobo Cheng | Zhengzhou University, China |
Shuaihang Pan | The University of Utah,United States |
Yuki Sakai | Tokyo Institute of Technology, Japan |
Yuying Zhang | University of Delaware, United States |
Best Editor Award:
The Associate Editor or Senior Editor with outstanding contributions in 2023 was selected by the Journal Award Committee based on the following criteria:
– The quality, speed and number of manuscript handling;
– The number of published papers in the journal;
– The number of invited manuscripts to the journal;
– Others, such as promoting the journal among peers or at conferences or providing advice for input or feedback regarding new regulations on the journal.
Best Youth Scholar Award:
The Editorial Board Member with outstanding contributions in 2023 was selected by the Journal Award Committee based on the following criteria:
– The number of published papers in the journal;
– The quality, speed and number of participating in peer-review works;
– Others, such as publicizing and promoting the journal at academic conferences and among peers or providing suggestions and guidance for the development of the journal.
Table 3: Winner of Best Editor Award and Best Youth Scholar Award
Award | Name | Institution |
Best Editor Award | Yi Du | Beihang University, China |
Best Youth Scholar Award | Zibin Chen | The Hong Kong Polytechnic University, China |
In 2024, we pledge to continue to adhere to the principle of high-quality publishing with higher standards, serve more scholars, publish more high-quality articles, and promote the development and progress of science. We would like to express our sincere appreciation to all contributors to Microstructures. We look forward to all of your continuous support to advance the development of the journal, and we expect more scientists and researchers in this research field to join us.
Editor: Qin Hao
Language Editor: Emma Chen
Production Editor: Yan Zhang
Respectfully Submitted by the Editorial Office ofMicrostructure
