Acknowledgment to Reviewers of Microstructures
A rigorous and impartial peer-review process is essential for the publication on a full scale, which can help authors revise their papers timely and maintain a sound academic environment. Here, we would like to sincerely thank each and every reviewer who dedicated his or her time and professional skills to reviewing manuscripts for Microstructures in 2021:
Name | Affiliation |
|---|---|
Jiamian Hu | Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, WI, USA. |
Fuyang Tian | Institute for Applied Physics, University of Science and Technology Beijing, Beijing, China. |
Wei Qiu | School of Mechanical Engineering, Tianjin University, Tianjin, China. |
Yingchun Cheng | Institute of Advanced Materials, Nanjing Tech University, Nanjing, Jiangsu, China. |
Yuan Huang | School of Physics, Beijing Institute of Technology, Beijing, China. |
Toshihiko Yokoyama | Department of Material Molecular Science, Institute for Molecular Science, Okazaki, Japan. |
Qilong Gao | International Laboratory for Quantum Functional Materials of Henan, School of Physics and Microelectronics, Zhengzhou University, Zhengzhou, Henan, China. |
Jun Zhong | Institute of Functional Nano & Soft Materials (FUNSOM), Jiangsu Key Laboratory for Carbon-Based Functional Materials and Devices, Soochow University, Suzhou, Jiangsu, China. |
Lianzhou Wang | Nanomaterials Centre, School of Chemical Engineering and Australian Institute for Bioengineering and Nanotechnology, The University of Queensland, Brisbane, QLD, Australia. |
Haijun Yu | Institute of Advanced Battery Materials and Devices, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, China. |
Siqi Shi | School of Materials Science and Engineering, Shanghai University, Shanghai, China. |
Xiaoxing Cheng | Department of Materials Science and Engineering, The Pennsylvania State University, Pennsylvania, USA. |
Xiaolin Wang | Institute of Superconducting and Electronic Materials (ISEM), Australian Institute for Innovative Materials (AIIM), University of Wollongong, Wollongong, NSW, Australia. |
Takao Mori | International Center for Materials Nanoarchitectonics (WPI-MANA), National Institute for Materials Science (NIMS), Ibaraki Prefecture, Japan. |
Zibin Chen | School of Aerospace, Mechanical and Mechatronic Engineering, The University of Sydney, Sydney, NSW, Australia. |
Guohong Zou | College of Chemistry, Sichuan University, Chengdu, Sichuan, China. |
Xing Zhou | State Key Laboratory of Materials Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology (HUST), Wuhan, Hubei, China. |
Tao Li | Department of Chemistry and Biochemistry, Northern Illinois University, DeKalb, IL, USA. |
Wenlei Zhu | School of Mechanical and Materials Engineering, Washington State University, Pullman, WA, USA. |
Shi Zhang Qiao | School of Chemical Engineering & Advanced Materials, The University of Adelaide, Adelaide, SA, Australia. |
Chengzhou Zhu | School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, QLD, Australia. |
Mingxing Zhang | Department of Clinical Medicine and Surgery, Federico II University Medical School of Naples, Naples, Italy. |
Bernd Gludovatz | School of Mechanical and Manufacturing Engineering, University of New South Wales , Sydney, NSW, Australia. |
Nicola Morley | Department of Materials Science and Engineering, University of Sheffield, Sheffield, UK. |
TAO YANG | Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong, China. |
Wassila Sekkal | Univ. Lille, CNRS, INRAE, Centrale Lille, Lille, France. |
Chunqiang Zhuang | Institute of Microstructure and Property of Advanced Materials, Beijing Key Lab of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing, China. |
Thank you all for providing professional review reports to journal submissions! To know more about preferential policies for journal reviewers, please contact our Editorial Office at editorialoffice@microstructj.com.
Respectfully Submitted by the Editorial Office
Microstructures
