fig8

Figure 8. (A) Interfacial thermal conductance and interfacial adhesion increase with rotation speed. (B) The relationship of interfacial thermal conductance and interfacial adhesion between PS film and sapphire[78] (Copyright 2015, American Chemical Society). (C) Thermal conductivity of stearic acid (SA), microencapsulated phase change materials (MPCM2), with 20 mg GO microencapsulated phase change materials (GO1@MPCM), and 40 mg GO microencapsulated phase change materials (GO2@MPCM)[67] (Copyright 2018, Elsevier). (D)Thermal conductivity of phase change microcapsules with different content of GO[80] (Copyright 2015, Royal Society of Chemistry).