fig7

Figure 7. (A and B) Qualitative comparison of responses generated by GPUmatLLM and Llama-3.1-8B-Instruct on GPU packaging domain questions with (A) via interconnect function in advanced packaging, and (B) thermal module materials and heat dissipation mechanisms; (C and D) Qualitative comparison of responses generated by GPUmatLLM and ChemLLM-7B-Chat on GPU packaging and thermal-management questions; (C) Main functions of heat spreaders in semiconductor packaging; (D) Purpose of adopting thermally conductive metals for the supporting structure. GPU: Graphics processing unit; RDL: redistribution layer; TIM: thermal interface material; CTE: coefficient-of-thermal-expansion; PCB: printed circuit board; I/O: input/output.