Editorial Board
26 Editors in 8 Countries/Region
Founding Editor-in-Chief
Zhifeng Ren 
zhifengren2013@gmail.com Department of Physics and Texas Center for Superconductivity at the University of Houston (TcSUH), University of Houston, Houston, TX, USA.
Research Interests: Flexible transparent electrodes; High performance thermoelectric materials; Catalysts for water splitting
Founding Editors
Chuanfei Guo
Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, Guangdong, China.
Research Interests: Electronic-skins; Body-comformal/flexible electronics; Abnormal micro-nano fabrication technology
Cunjiang Yu
Department of Engineering Science and Mechanics, Department of Biomedical Engineering, and Materials Research Institute, Pennsylvania State University, University Park, PA, USA.
Research Interests: Soft sensors and electronics; Thin film organic and inorganic electronics; Biomedical sensors and electronics; Soft robotics
Editorial Board Members
Renkun Chen
Department of Mechanical and Aerospace Engineering, University of California, San Diego, CA, USA.
Research Interests: Thermoelectric materials and devices; Micro and nano-scale heat transfer; Phase change heat transfer; Nanoscalle energy conversion and storage
Wei Chen
Department of Physics, University of Texas at Arlington, Arlington, TX, USA.
Research Interests: Nanotechnology; nanomaterials; luminescence; cancer nanotechnology; photodynamic therapy
Xiaodong Chen
School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore.
Research Interests: Soft materials; Flexible electronics
Zhi-Gang Chen
School of Chemistry and Physics, Queensland University of Technology, Brisbane, QLD, Australia.
Research Interests: Thermoelectric materials and devices; Topological Insulators; Compound Semiconductors; Functional Materials; Nanotechnology; Compound Semiconductors; Nanotechnology; Functional Materials
Nicholas X. Fang
Department of Mechanical Engineering, University of Hong Kong, Hong Kong, China.
Research Interests: Engineered optical; Acoustic metamaterials
Wei Hong
Department of Mechanics and Aerospace Engineering, Southern University of Science and Technology, Shenzhen, Guangdong, China.
Research Interests: Dielectric materials; Fracture mechanics; Hydrogel; Materials science; Soft matter; Solid mechanics
Dae-Hyeong Kim
School of Chemical and Biological Engineering, Seoul National University, Seoul, Korea.
Research Interests: Soft electronics
Flexible and Stretchable Electronics Based on Nanotechnology
Ziqi Liang
Department of Materials Science, Fudan University, Shanghai, China.
Research Interests: Organic/perovskite semiconductors based opto-thermoelectronics
Junming Liu
School of Physics, Nanjing University, Nanjing, Jiangsu, China.
Research Interests: Ferroelectrics/multiferroics; Multifunctional materials; Computational materials
Takao Mori
International Center for Materials Nanoarchitectonics, National Institute for Materials Science, Tsukuba, Japan.
Research Interests: Nanomaterials and Nanobiology; Thermal Conductivity; Thermoelectrics
Kornelius Nielsch
Institute for Metallic Materials, Dresden University of Technology, Dresden, Germany.
Research Interests: Thermoelectric nanowires; Nanograined bulk materials and devices; Synthesis of 3D nanostructures
Mehmet Ozturk
Department of Electrical and Computer Engineering, NC State University, Raleigh, NC, USA.
Research Interests: Flexible thermoelectric devices
Damiano Pasini
Department of Mechanical Engineering, McGill University, Quebec, Canada.
Research Interests: Soft mechanical metamaterials; Soft robotics; Kirigami; Origami; Morphing metamaterials; Multistability in soft matter; Multiphysics; Multiscale mechanics.
John A. Rogers
Departments of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
Research Interests: Soft materials for conformal electronics; Nanophotonic structures; Microfluidic devices
Young Min Song
School of Electrical Engineering and Computer Science, Gwangju Institute of Science and Technology, Gwangju, Korea.
Flexible and Stretchable Electronics Based on Nanotechnology
Da-Wei Wang
School of Chemical Engineering, University of New South Wales, Sydney, NSW, Australia.
Research Interests: Nanomaterials, Functional Materials, Physical Chemistry of Materials, Electrochemistry, Energy Generation, Conversion and Storage Engineering
Zhigang Wu
School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, Hubei, China.
Research Interests: Bionic Microrobot; Soft robot; Soft intelligent Sensing; Soft base material advanced manufacturing
Xinge YU
Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
Research Interests: Skin-integrated electronics; Haptic interfaces; Bio-integrated electronics; human-machine interfaces; Biomedical engineering
Yihui Zhang
Department of Engineering Mechanics, Tsinghua University, Beijing, China.
Research Interests: Mechanically-guided 3D assembly; Unusual soft materials; Stretchable and flexible electronics; Mechanics of smart materials and structures
Flexible and Stretchable Electronics Based on Nanotechnology
Yu Shrike Zhang
Department of Medicine, Harvard Medical School, Boston, MA, USA.
Research Interests: 3D bioprinting; Organs-on-chips; Microfluidics; Bioanalysis
Li-Dong Zhao
School of Materials Science and Engineering, Beihang University, Beijing, China.
Research Interests: Thermoelectric energy materials; Superconducting materials
Ruike Zhao
Department of Mechanical Engineering, Stanford University, Stanford, CA, USA.
Research Interests: Soft materials; Soft robotics; Biomechanics; Bioengineering
Chunyi Zhi
Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong, China.
Research Interests: Wearable energy storage devices; Aqueous electrolyte battery
All members of the Editorial Board have identified their affiliated institutions or organizations, along with the corresponding country or geographic region. OAE Publishing Inc. remains neutral with regard to any jurisdictional claims.
