Topic: High-performance Thermoelectric Materials and Devices from Microstructures to Applications
Guest Editor(s)
Prof. Zhi-Gang Chen
School of Chemistry and Physics, Queensland University of Technology, Queensland, Australia.
Prof. Guang Han
College of Materials Science and Engineering, Chongqing University, Chongqing, China.
Special Issue Introduction
Confronting the ever-increasing energy demand, it is of vital importance to develop sustainable energy conversion and storage technologies. Thermoelectric technology, enabling the direct and reversible conversion of heat into electricity, provides an opportunity to utilize ubiquitous heat for power generation. Importantly, this technology can also be applied for refrigeration, offering fast response and precise temperature control, making it quite promising for spot cooling of electronic devices.
Thermoelectric performance of materials is central to their applications and is correlated with various factors, such as crystal structures, microstructures, defects, as well as synthesis and processing techniques. Among these factors, microstructures play a vital role in influencing carrier and phonon transports. Consequently, constructing multi-scale microstructures has been regarded as an effective strategy to attain superior thermoelectric performance. Thus, disclosing the fundamental relationship between microstructures and thermoelectric performance is crucial in guiding the rational design and synthesis of high-performance thermoelectric materials.
This Special Issue aims to report significant developments and breakthroughs in thermoelectric materials, with a special focus on “microstructures”. We encourage thermoelectric researchers to contribute by submitting manuscripts showcasing their excellent research in developing high-performance thermoelectric materials/devices through elaborate microstructure design. This Special Issue is expected to serve as an excellent platform for highlighting the latest progress in the field of thermoelectrics through microstructure design. The Special Issue will include, but are not limited to, the following:
● Multi-scale microstructure construction via innovative materials synthesis strategies;
● Novel thermoelectric bulk materials, flexible films, and low-dimensional materials;
● Advanced microstructure characterization of thermoelectric materials;
● Microstructure origin of high thermoelectric performance;
● Computational study on rational microstructure design;
● Devices based on high-performance thermoelectric materials.
Thermoelectric performance of materials is central to their applications and is correlated with various factors, such as crystal structures, microstructures, defects, as well as synthesis and processing techniques. Among these factors, microstructures play a vital role in influencing carrier and phonon transports. Consequently, constructing multi-scale microstructures has been regarded as an effective strategy to attain superior thermoelectric performance. Thus, disclosing the fundamental relationship between microstructures and thermoelectric performance is crucial in guiding the rational design and synthesis of high-performance thermoelectric materials.
This Special Issue aims to report significant developments and breakthroughs in thermoelectric materials, with a special focus on “microstructures”. We encourage thermoelectric researchers to contribute by submitting manuscripts showcasing their excellent research in developing high-performance thermoelectric materials/devices through elaborate microstructure design. This Special Issue is expected to serve as an excellent platform for highlighting the latest progress in the field of thermoelectrics through microstructure design. The Special Issue will include, but are not limited to, the following:
● Multi-scale microstructure construction via innovative materials synthesis strategies;
● Novel thermoelectric bulk materials, flexible films, and low-dimensional materials;
● Advanced microstructure characterization of thermoelectric materials;
● Microstructure origin of high thermoelectric performance;
● Computational study on rational microstructure design;
● Devices based on high-performance thermoelectric materials.
Submission Deadline
30 May 2024
Submission Information
For Author Instructions, please refer to https://www.oaepublish.com/microstructures/author_instructions
For Online Submission, please login at https://oaemesas.com/login?JournalId=microstructures&IssueId=M230921
Submission Deadline: 30 May 2024
Contacts: Yanlin Huang, Assistant Editor, assistant_editor@microstructj.com
